Air Cooling is the most common and widely used methodology for cooling electronic packages and systems due to its cost effectiveness and simplicity in operation and construction.
Natural and forced convection are of the two most common methods used across the industry. Depending upon the system constraints and thermal performance requirements, a specific method is selected and implemented. This is usually coupled with advancements happening which includes heat pipes, vapor chambers etc. at the heat sink level.
Cool it by Pankaj is capable of designing and manufacturing various types of Air Cooling solutions that range from simple extrusions to high density wide extrusion profiles used in high heat dissipation applications. Complicated heat sink profiles are handled efficiently with advanced cooling technologies in the required form factor. Our in-depth knowledge results in a high performance solution which helps in increasing the product life and reliability.